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- Author: Victor E Borisenko
- Publisher: Springer
- Year: 2013
- Pages: 358
- ISBN-10: 148991806X
- ISBN-13: 9781489918062
- Format: 15.6 x 23.4 x 2 cm, softcover
- Language: English
- SAVE -10% with code: EXTRA
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Description
Rapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processes, and conditions. They thoroughly cover the work of international investigators in the field.
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- Author: Victor E Borisenko
- Publisher: Springer
- Year: 2013
- Pages: 358
- ISBN-10: 148991806X
- ISBN-13: 9781489918062
- Format: 15.6 x 23.4 x 2 cm, softcover
- Language: English English
Rapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processes, and conditions. They thoroughly cover the work of international investigators in the field.
Reviews