408,68 €
454,09 €
-10% with code: EXTRA
Packaging of High Power Semiconductor Lasers
408,68 € 
- We will send in 10–14 business days.
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
454.09
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- Author: Xingsheng Liu
- Publisher: Springer
- ISBN-10: 1461492629
- ISBN-13: 9781461492627
- Format: 15.6 x 23.4 x 2.4 cm, kieti viršeliai
- Language: English
- SAVE -10% with code: EXTRA
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Description
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
EXTRA 10 % discount with code: EXTRA
408,68 €
454,09 €
We will send in 10–14 business days.
The promotion ends in 24d.06:10:47
The discount code is valid when purchasing from 10 €. Discounts do not stack.
- Author: Xingsheng Liu
- Publisher: Springer
- ISBN-10: 1461492629
- ISBN-13: 9781461492627
- Format: 15.6 x 23.4 x 2.4 cm, kieti viršeliai
- Language: English English
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
Reviews