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- Author: George G Harman
- Publisher: Kluwer Academic Publishers
- ISBN-10: 0792351398
- ISBN-13: 9780792351399
- Format: 15.6 x 23.4 x 1.9 cm, hardcover
- Language: English
- SAVE -10% with code: EXTRA
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Description
Preface. 1. Packaging and Interconnection Trends - Present and Future. 2. Solder and Flip Chip Interconnections and Assembly. 3. Single Chip Interconnection and Qualification: Wire Bonding and TAB. 4. Multichip Module Interconnections and Assembly I. 5. Discussion with the Dean and Vice Chancellor of the Czech Technical University and People from the Czech and the Slovak ISHM Chapters. 6. Multichip Module Interconnections and Assembly II. 7. Thick Film Interconnections and Metallurgical Interactions I. 8. Thick Film Interconnections and Metallurgical Interactions II. Subject Index.
EXTRA 10 % discount with code: EXTRA
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- Author: George G Harman
- Publisher: Kluwer Academic Publishers
- ISBN-10: 0792351398
- ISBN-13: 9780792351399
- Format: 15.6 x 23.4 x 1.9 cm, hardcover
- Language: English English
Preface. 1. Packaging and Interconnection Trends - Present and Future. 2. Solder and Flip Chip Interconnections and Assembly. 3. Single Chip Interconnection and Qualification: Wire Bonding and TAB. 4. Multichip Module Interconnections and Assembly I. 5. Discussion with the Dean and Vice Chancellor of the Czech Technical University and People from the Czech and the Slovak ISHM Chapters. 6. Multichip Module Interconnections and Assembly II. 7. Thick Film Interconnections and Metallurgical Interactions I. 8. Thick Film Interconnections and Metallurgical Interactions II. Subject Index.
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