110,06 €
122,29 €
-10% with code: EXTRA
MEMS Packaging Technologies and 3D Integration
MEMS Packaging Technologies and 3D Integration
110,06
122,29 €
  • We will send in 10–14 business days.
This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.
  • Publisher:
  • ISBN-10: 3036542582
  • ISBN-13: 9783036542584
  • Format: 17 x 24.4 x 1.8 cm, hardcover
  • Language: English
  • SAVE -10% with code: EXTRA

MEMS Packaging Technologies and 3D Integration (e-book) (used book) | bookbook.eu

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This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.

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  • Publisher:
  • ISBN-10: 3036542582
  • ISBN-13: 9783036542584
  • Format: 17 x 24.4 x 1.8 cm, hardcover
  • Language: English English

This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.

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