64,61 €
71,79 €
-10% with code: EXTRA
Latest Advances in Electrothermal Models
Latest Advances in Electrothermal Models
64,61
71,79 €
  • We will send in 10–14 business days.
This book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulation program; (b) modelling thermal properties of inductors taking into account the influence of the core volume on the efficiency of heat removal; (c) investigations into the problem of inserting a te…
71.79
  • Publisher:
  • ISBN-10: 303650334X
  • ISBN-13: 9783036503349
  • Format: 17 x 24.4 x 1.3 cm, kieti viršeliai
  • Language: English
  • SAVE -10% with code: EXTRA

Latest Advances in Electrothermal Models (e-book) (used book) | bookbook.eu

Reviews

Description

This book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulation program; (b) modelling thermal properties of inductors taking into account the influence of the core volume on the efficiency of heat removal; (c) investigations into the problem of inserting a temperature sensor in the neighbourhood of a chip to monitor its junction temperature; (d) computations of the internal temperature of power LEDs situated in modules containing multiple-power LEDs, taking into account both self-heating in each power LED and mutual thermal couplings between each diode; (e) analyses of DC-DC converters using the electrothermal averaged model of the diode-transistor switch, including an IGBT and a rapid-switching diode; (f) electrothermal modelling of SiC power BJTs; (g) analysis of the efficiency of selected algorithms used for solving heat transfer problems at nanoscale; (h) analysis related to thermal simulation of the test structure dedicated to heat-diffusion investigation at the nanoscale.

EXTRA 10 % discount with code: EXTRA

64,61
71,79 €
We will send in 10–14 business days.

The promotion ends in 22d.23:45:54

The discount code is valid when purchasing from 10 €. Discounts do not stack.

Log in and for this item
you will receive 0,72 Book Euros!?
  • Publisher:
  • ISBN-10: 303650334X
  • ISBN-13: 9783036503349
  • Format: 17 x 24.4 x 1.3 cm, kieti viršeliai
  • Language: English English

This book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulation program; (b) modelling thermal properties of inductors taking into account the influence of the core volume on the efficiency of heat removal; (c) investigations into the problem of inserting a temperature sensor in the neighbourhood of a chip to monitor its junction temperature; (d) computations of the internal temperature of power LEDs situated in modules containing multiple-power LEDs, taking into account both self-heating in each power LED and mutual thermal couplings between each diode; (e) analyses of DC-DC converters using the electrothermal averaged model of the diode-transistor switch, including an IGBT and a rapid-switching diode; (f) electrothermal modelling of SiC power BJTs; (g) analysis of the efficiency of selected algorithms used for solving heat transfer problems at nanoscale; (h) analysis related to thermal simulation of the test structure dedicated to heat-diffusion investigation at the nanoscale.

Reviews

  • No reviews
0 customers have rated this item.
5
0%
4
0%
3
0%
2
0%
1
0%
(will not be displayed)