Development of advanced endpoint detection and process control for chemical mechanical polishing (CMP) in VLSI circuit fabrication
Development of advanced endpoint detection and process control for chemical mechanical polishing (CMP) in VLSI circuit fabrication
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  • Publisher:
  • Year: 2000
  • Pages: 123
  • ISBN-10: 3826578058
  • ISBN-13: 9783826578052
  • Format: 14.9 x 21 x 1 cm, minkšti viršeliai
  • Language: English

Development of advanced endpoint detection and process control for chemical mechanical polishing (CMP) in VLSI circuit fabrication (e-book) (used book) | bookbook.eu

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  • Author: Götz Springer
  • Publisher:
  • Year: 2000
  • Pages: 123
  • ISBN-10: 3826578058
  • ISBN-13: 9783826578052
  • Format: 14.9 x 21 x 1 cm, minkšti viršeliai
  • Language: English English

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