324,17 €
360,19 €
-10% with code: EXTRA
Ceramic Materials CT Vol 150
Ceramic Materials CT Vol 150
324,17
360,19 €
  • We will send in 10–14 business days.
This volume contains a collection of 40 papers from two symposia: Advanced Dielectric Materials and Multilayer Electronic Devices and High Strain Piezoelectric Materials, Devices and Applications. Topics include fundamental and historical perspectives of dielectric materials; relaxor materials and devices; high strain piezoelectric devices; advanced aspects of powder preparation, characterization, and properties; thin films; materials for low and high frequency applications; processing-structur…
  • Publisher:
  • ISBN-10: 1574982052
  • ISBN-13: 9781574982053
  • Format: 15.8 x 23.4 x 3.3 cm, kieti viršeliai
  • Language: English
  • SAVE -10% with code: EXTRA

Ceramic Materials CT Vol 150 (e-book) (used book) | Nair | bookbook.eu

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This volume contains a collection of 40 papers from two symposia: Advanced Dielectric Materials and Multilayer Electronic Devices and High Strain Piezoelectric Materials, Devices and Applications. Topics include fundamental and historical perspectives of dielectric materials; relaxor materials and devices; high strain piezoelectric devices; advanced aspects of powder preparation, characterization, and properties; thin films; materials for low and high frequency applications; processing-structure-property-relationships; and future applications.

Proceedings of the symposium held at the 105th Annual Meeting of The American Ceramic Society, April 27-30, 2003, in Nashville, Tennessee; Ceramic Transactions, Volume 150.

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  • Author: Nair
  • Publisher:
  • ISBN-10: 1574982052
  • ISBN-13: 9781574982053
  • Format: 15.8 x 23.4 x 3.3 cm, kieti viršeliai
  • Language: English English

This volume contains a collection of 40 papers from two symposia: Advanced Dielectric Materials and Multilayer Electronic Devices and High Strain Piezoelectric Materials, Devices and Applications. Topics include fundamental and historical perspectives of dielectric materials; relaxor materials and devices; high strain piezoelectric devices; advanced aspects of powder preparation, characterization, and properties; thin films; materials for low and high frequency applications; processing-structure-property-relationships; and future applications.

Proceedings of the symposium held at the 105th Annual Meeting of The American Ceramic Society, April 27-30, 2003, in Nashville, Tennessee; Ceramic Transactions, Volume 150.

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