- We will send in 10–14 business days.
/images/books/2800946/9780071737739.jpg)
- Author: Ken Gilleo
- Publisher: McGraw-Hill
- Year: 2003
- ISBN-10: 0071737731
- ISBN-13: 9780071737739
- Format: 19.1 x 23.5 x 1.2 cm, softcover
- Language: English
- SAVE -10% with code: EXTRA
Reviews
Description
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
EXTRA 10 % discount with code: EXTRA
The promotion ends in 18d.14:00:38
The discount code is valid when purchasing from 10 €. Discounts do not stack.
- Author: Ken Gilleo
- Publisher: McGraw-Hill
- Year: 2003
- ISBN-10: 0071737731
- ISBN-13: 9780071737739
- Format: 19.1 x 23.5 x 1.2 cm, softcover
- Language: English English
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
Reviews